EIT 2017 - Technical Program Committee

eit 2017 Technical Program Committee

Date/Location
Nebraska Student Union - City Campus
May 14-17, 2017
Lincoln, Nebraska, U.S.A.

Important Dates
Submission of full papers:
February, 2017

Notification of acceptance:
April 10, 2017

Final Manuscript in PDF form:
April 15, 2017

Author registration deadline:
April 15, 2017


  • Cristinel Ababei, Marquette University
  • Mehmet Akcakaya, University of Minnesota
  • Marcelo Algrain, Caterpillar, Inc.
  • Hesham Ali, University of Nebraska-Omaha
  • Christos Argyropoulos, University of Nebraska-Lincoln
  • Sohrab Asgarpoor, University of Nebraska-Lincoln
  • Azad Azadmanesh, University of Nebraska-Omaha
  • Frederick Berry, Purdue University
  • Leonard Bohmann, Michigan Tech
  • Subhonmesh Bose, University of Illinois, Urbana-Champaign
  • Eunjong Choi, Nara Institute of Science and Technology, Japan
  • Fred Choobineh, University of Nebraska-Lincoln
  • Jennifer Clarke, University of Nebraska-Lincoln
  • Donald Cox, University of Nebraska-Lincoln
  • Joanne Degroat, Ohio State University
  • Hyunsook Do, University of North Texas
  • Alan Dostal, Nebraska Public Power District
  • Rudra Dutta, North Carolina State University
  • Ozkan Ufuk, Erciyes University, Turkey
  • Amin Fakhrazari, Pacific Gas & Electric
  • Reza Fazel Rezaei, University of North Dakota
  • Harvey Freeman, IEEE COMSEC, HAF Consulting
  • Robin Gandhi, University of Nebraska-Omaha
  • Subra Ganesan, Oakland University
  • Randall Geiger, Iowa State University
  • Haifeng Guo, University of Nebraska-Omaha
  • Roland Haas, Indian Institute of IT, Bangladore, India
  • Matthew Hale, University of Nebraska-Omaha
  • Tapio Heikkilä, Technical Research Centre Of Finland Ltd
  • Qing Hui, University of Nebraska-Lincoln
  • Afshin Izadian, Indiana Purdue University
  • David Jones, University of Nebraska-Lincoln
  • Saeed Kamalinia, S&C Electric Company
  • Faisal Khan, University of Missouri, Kansas City
  • Amin Khodaei, University of Denver
  • Daisuke Kihara, Purdue University
  • Taesic Kim, Texas A&M University-Kingsville
  • David Koehler, Doble Engineering Company
  • Mahesh Krishnamurthy, Illinois Institute of Technology
  • Sandeep Kuttal, University of Tulsa
  • Michael Lightner, University of Colorado-Boulder
  • Russ Meier, Milwaukee School of Engineering
  • Mani Mina, Iowa State University
  • Joydeep Mitra, Michigan State University
  • Dietmar Moeller, University of Clausthal, Germany
  • Salman Mohagheghi, Colorado School of Mines
  • Hossein Mousavinezhad, Idaho State University
  • Majid Nabavi, University of Nebraska-Lincoln
  • Ozkan Ufuk Nalbantoglu, Erciyes University, Turkey
  • Tung Thanh Nguyen, Utah State University
  • Sima Noghanian, North Dakota State University
  • Damir Novosel, Quanta-Technology
  • Wilkistar Otieno, University of Wisconsin-Milwaukee
  • Hasan Otu, University of Nebraska-Lincoln
  • Dean Patterson, FASCO, Asia Pacific, Australia
  • Lance Perez, University of Nebraska-Lincoln
  • Erik Psota, University of Nebraska-Lincoln
  • Yi Qian, University of Nebraska-Lincoln
  • Wei Qiao, University of Nebraska-Lincoln
  • Liyan Qu, University of Nebraska-Lincoln
  • Byrav Ramamurthy, University of Nebraska-Lincoln
  • Wanda Reder, S&C Electric Company
  • Fahimeh Rezaei, VISA Co.
  • Jim Riess, NV5 Sebesta
  • Diane Rover, Iowa State University
  • Dan Rubin, Union Pacific, Omaha
  • Khalid Sayood, University of Nebraska-Lincoln
  • Walter Schilling, Milwaukee School of Engineering
  • Mohammad Shahidehpour, Illinois Institute of Technology
  • Hamid Sharif, University of Nebraska-Lincoln
  • Krishna Sivalingam, Indian Institute of Technology Madras, India
  • Harvey Siy, University of Nebraska-Omaha
  • Myoungkyu Song, University of Nebraska-Omaha
  • Mahadevan Subramaniam, University of Nebraska-Omaha
  • Suresh Subramaniam, George Washington University
  • Hamid Vakilzadian, University of Nebraska-Lincoln
  • Mehmet Can Vuran, University of Nebraska-Lincoln
  • Yong Wang, Dakota State University
  • Jin Wang, Ohio State University
  • Wei Wang, San Diego State University
  • Honggang Wang, University of Massachusetts, Dartmouth
  • Jay D. Wierer, Milwaukee School of Engineering
  • Tadeusz Wysocki, University of Nebraska-Lincoln
  • Lisong Xu, University of Nebraska-Lincoln
  • Qiben Yan, University of Nebraska-Lincoln
  • Feng Ye, University of Dayton
  • Reishi Yokomori, Nagoya University, Japan
  • Norihiro Yoshida, Nagoya University, Japan
  • Jong-Hoon Youn, University of Nebraska-Omaha
  • Tingting Yu, University of Kentucky
  • Yanxiao Zhao, South Dakota State University