Mesoscale Lab Patents

  1. R.F. Saraf, G. Singh, Direct detection of localized modulation of ion concentration on an electrode-electrolyte interface, US Patent 7,826,060 B2, 11/2/10.
  2. R.F. Saraf, ‘High Resolution thin film tactile device to detect distribution of stimulation by touch’, US Patent 7,718,950 B2, 05/18/10.
  3. F.E. Doany, J.R. Marino, C.J. Sambucetti, R.F. Saraf, ‘Means of seeding and metallizing polyimide’,US Patent 7,033,648, 04/25/06.
  4. R.F. Saraf, S. Niu, ‘Bio-chip pPhotoluminescenct method for identifying biological material, and apparatus for use with such methods and bio-Chips’, US Patent 6,706,479 B2,  issued 03/16/04.
  5. J.M. Roldan, R.F. Saraf, et al., ‘Method for forming an antenna and a radio Frequency transponder’, US Patent 6,662,430,  issued 12/16/03.
  6. R.F. Saraf, H.K. Wickramasinghe, ‘Self assembled nano-devices using DNA’, US Patent 6,656,693, issued 12/02/03.
  7. R.F. Saraf, ‘Synthesis of chemical tags’, US Patent 6,632,612, 10/14/03.
  8. M. Angelopoulos, Y. Liao, R.F. Saraf, ‘Plasticized, antiplasticized and crystalline conducting polymers and precursors thereof’, US Patent 6,616,863, 09/09/03.
  9. A. Gupta, R.F. Saraf, ‘Micro goniometer for scanning probe microscopy’, US Patent 6,552,339, 04/22/03.
  10. H.K. Wickramasinghe, R.F. Saraf., ‘Ferroelectric storage read-write memory’, US Patent 6,548,843, 04/15/03.
  11. R.F. Saraf, H.K. Wickramasinghe, ‘Nano-devices using block-copolymers’, US Patent 6,403,321, 06/11/02.
  12. J.M. Cotte, J.M. Roldan. J.M. Sambucetti, J. Carlos, R.F. Saraf, ‘Electrode modification using an unzippable polymer paste,’ US Patent 6,281,105, 08/28/01.
  13. R.F.Saraf, et al., ‘Radio Frequency (RF) Transponder (TAG) with composite antenna’, US Patent 6,271,793, issued 8/7/01.
  14. M.J. Brady, D. Duan, R.F. Saraf,  J. Rubino, ‘RFID transponders with paste antennas and flip-chip attachment’, US Patent 6,259,408, 07/10/01.
  15. A. Gupta, R.F. Saraf, ‘Ultra high density storage media and method thereof’, US Patent 6,236,589, 05/22/01.
  16. R.F. Saraf, et al., ‘Electrode modification using an unzippable polymer paste’, US Patent 6,221,503, issued 4/24/01. 
  17. R.F. Saraf, H.K. Wickramasinghe, ‘Nano-devices using block-copolymers’, US Patent 6,218,175, issued 4/17/01.
  18. M. Angelopoulos, R.F. Saraf, et al.,  ‘Polycrystalline conducting polymers and precursors therof having adjustable morphology and properties’, US Patent 6,210,606, issued 4/3/01
  19. R.F. Saraf, J.M. Roldan, ‘Lead free conductive composites for electrical interconnections’,  US Patent 6,197,222, issued 03/06/01.
  20. A.A. Ardakani, M. Angelopoulos, V.A. Bourgault, L.D. Comerford , L.D. Comerford, M.W. Mirre, S.E. Molis, R.F. Saraf, J.M. Shaw, P.J. Spellane, N.M. Patel, ‘Electrically conductive polymeric materials and use thereof’, US Patent 6,168,732, 01/02/01.
  21. A.A. Ardakani, M. Angelopoulos, V.A. Bourgault, L.D. Comerford , L.D. Comerford, M.W. Mirre, S.E. Molis, R.F. Saraf, J.M. Shaw, P.J. Spellane, N.M. Patel, ‘Electrically conductive polymeric materials and use thereof’, US Patent 6,149,840, 11/2/00.
  22. J.M. Roldan, R.F. Saraf, ‘Lead-free interconnection for electronic devices’, US Patent  6,127,253’, 10/03/00.
  23. R.F. Gupta, R.F. Saraf, ‘Micro goniometer for scanning microscopy’, US Patent 6,100,523,  issued 8/08/00.
  24. J.M. Roldan, K.L. Mittal, R.F. Saraf, ‘Enhanced adhesion between a vapor deposited metal and an organic polymer surface exhibiting tailored morphology’, US Patent 6,099,939, issued 8/08/00.
  25. A. Gupta, R.F. Saraf. ‘Ultra high density storage media and method thereof’, US Patent  6,017,618, 01/25/00.
  26. M. Angelopoulos, R.F. Saraf, et al., ‘Composition containing a polymer and conductive filler and use therof’, US Patent 6,015,509, issued 1/18/00.
  27. J.M. Roldan, R.F. Saraf, et al., ‘Electrode modification using an unzippable polymer paste’, US Patent 6,013,713, issued 1/11/00.
  28. R.F. Gupta, R.F. Saraf, ‘Ultra high density storage media and method thereof’, US Patent 6,017,618, issued 12/21/99.
  29. J.M. Roldan, R.F. Saraf, et al., ‘Lead-free interconnection for electronic devices’, US Patent 6,005,292, issued 12/21/99.
  30. M. Angelopoulos, R.F. Saraf, et al., ‘Method for providing discharge protection or shielding’, US Patent 5,997,773, issued 12/07/99.
  31. M. Angelopoulos, R.F. Saraf, et al., ‘Housing for electromagnetic interference shielding’, US Patent 5,985,458, issued 11/16/99.
  32. M. Angelopoulos, R.F. Saraf, et al., ‘Method of fabricating plasticized antiplasticized and crystalline conducting polymers and precursors thereof’, US Patent 5,969,024, issued 10/19/99.
  33. M. Angelopoulos, R.F. Saraf, et al., ‘Organic-Metallic composite coating for copper surface protection’, US Patent 5,960,251, issued 08/28/99.
  34. M. Angelopoulos, Y. Liao, R.F. Saraf, ‘Polycrystalline conducting polymers and precursors thereof, having adjustable morphology and physical properties’, US Patent 5,932,143, 08/3/99.
  35. M. Angelopoulos, Y. Liao, R.F. Saraf, ‘Plasticized, antiplasticized and crystalline conducting polymers’, US Patent 5,928,566, 07/27/99.
  36. M. Angelopoulos, R.F. Saraf, et al., ‘Composite comprising a metal substrate and a corrosion protecting layer’, US Patent 5,922,466, issued 07/13/99.
  37. M. Angelopoulos, R.F. Saraf, et al., ‘Method for providing discharge protection or shielding’, US Patent 5,916,486, issued 06/29/99.
  38. R.F. Saraf, J.M. Roldan, M. Liehr, C. Sambucetti, ‘Direct chip attach for low alpha emission interconnect system’, US Patent 5,897,336, issued 04/27/99.
  39. R.B. Booth, E.I. Cooper, M. Gaynes, S.P. Ostrander,  J.M. Roldan, C.J. Sambucetti, R.F. Saraf,  ‘Lead free conductive composite for electrical interconnections’,  US Patent 5866044, issued 2/2/99,  NI-85116 (Taiwan), 07/15/97.
  40. J.M. Roldan, R.F. Saraf, ‘Lead-free interconnection for electronic devices,’ US Patent 5,854,514, 12/29/98.
  41. M. Angelopoulos, V.A. Brusic, T.O. Graham, S. Purushotthaman, R.F. Saraf,  J.M. Shaw, J.M. Roldan,  A.Viehbeck, ‘Electronic package comprising a substrate and a semiconductor device bonded thereto’, US Patent 5776587,  issued 07/07/98.
  42. R.B. Booth, M. Gaynes, R.M. Murcko, V. Puligandla, J.M. Roldan, R.F. Saraf, J.M. Zalesinski,  ‘Direct chip attachment (DCA) with electrically conductive adhesives’, US Patent 5747101,  issued 05/05/98.
  43. M. Angelopoulos, V.A. Brusic, T.O. Grahm, S. Purushothaman, J.M. Roldan, R.F. Saraf, J.M. Shaw, A. Viehbeck, ‘Composition containing a polymer and conductive filler and use thereof’, US Patent 5700398, issued 12/23/97.
  44. R.B. Booth, E.I. Cooper, E.A. Giess, M.R. Kordus, S. Krongelb, S.P. Ostrander, J.M. Roldan, C.J. Sambucetti, R.F. Saraf, ‘Fabrication of double side fully mettalized plated thru-holes, in polymer structures, without seeding or photoprocess’,  US Patent 5545429, issued 08/13/96. 
  45. R.B. Booth, M.A. Gaynes, R.M. Murco, V. Puligandla, J.M. Roldan, R.F. Saraf, J.M. Zalesinski, ‘Direct chip attach (DCA) with electrically conductive adhesives’, US Patent 5543585, issued 08/06/96. 
  46. F. E. Doany, G.W. Grube, R.F. Saraf, ‘Unzippable polymer mask for screening operations’, US Patent 5314709, issued 05/24/94; 2045187 (Japan).
  47. E.J. O'Sullivan, T.R. O'Toole, J.M. Roldan, L.T. Romankiw, C.J. Sambucetti, R.F. Saraf, ‘Electroless metal adhesion to organic dielectric material with phase separated morphology’, US Patent 5310580, issued 05/10/94. 
  48. C. Feger, R.T. Hodgson, D.A. Lewis, R.F. Saraf, ‘Morphological Composite material formed from different precursors’, US Patent 5288842, issued 02/22/94; 2538151 (Japan).
  49. W.S. Huang, I.Y. Khandros, R.F. Saraf, L. Shi, ‘Novel reworkable joining system containing metallic joint and polymer encapsulation’, US Patent 5062896, issued 11/5/91; 50450278 (France), 69105793 (Germany), 2004078 (Japan).