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Qu named senior member of National Academy of Inventors

February 27, 2024

Liyan Qu in a lab

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un Wang, Assistant Professor in Electrical & Computer Engineering, holds two variants of the novel 10 kV SiC MetaPak switch cells inside his lab in the Scott Engineering Center. MetaPak is a fail-safe SiC device packaging platform designed to enable next-generation, high-frequency, ultra-resilient energy infrastructure and was previously sponsored by ARPA-E IGNIITE. In the new ARPA-E VisionOPEN program, Wang will develop another novel packaging platform called LincolnPak.

Nebraska Engineering researcher's LincolnPak aims to make data centers more energy efficient

March 6, 2026

Nebraska flag flying on a winter day

Two engineering professors named NAI Senior Members

February 27, 2026

A student exits Louise Pound Hall. Feb. 17, 2026.

From Nebraska Today

Achievements | Honors, appointments and publications for Feb. 27

February 27, 2026

A red flag with a white Husker N waves over a sidewalk on the University of Nebraska–Lincoln's City Campus. Snow covers the ground.

From Nebraska Today

Record five Husker researchers named NAI Senior Members

February 26, 2026

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